DFM Optimization for Telecommunications Equipment Enclosure Stamping
Summary
Cisco Systems achieved 44% reduction in stamping operations and 96% first-pass quality rates for 5G network equipment enclosures through progressive die optimization. The project eliminated secondary operations and integrated EMI shielding features while meeting FCC electromagnetic compatibility standards.
The Challenge
Initial Need:
Cisco's San Jose manufacturing facility faced critical production challenges in their sheet metal stamping operations for 5G small cell equipment enclosures, requiring complex forming operations and precise dimensional control to ensure electromagnetic interference shielding effectiveness and weatherproof sealing performance. The original design necessitated 11 separate stamping operations using multiple progressive dies.
Pain Points:
Multiple stamping operations: 11 separate forming stages requiring 47-minute total cycle time per enclosure
Secondary finishing requirements: 76% of enclosures requiring deburring and edge finishing operations
EMI shielding performance issues: 18% of assemblies failing electromagnetic compatibility testing due to dimensional variations
Die maintenance complexity: 6 different progressive dies requiring synchronized maintenance schedules
Our Solution
Our Approach:
The DFM optimization focused on consolidating multiple forming operations into integrated progressive die sequences, optimizing material utilization through advanced nesting algorithms, and incorporating EMI shielding features directly into the stamping process to eliminate secondary operations. The engineering team implemented comprehensive electromagnetic simulation using ANSYS HFSS software.
Methodology:
Engineers utilized AutoForm stamping simulation software to analyze material flow patterns, springback compensation requirements, and potential defect locations across 8 different progressive die design iterations. Advanced die design incorporated nitrogen-assisted forming for complex bend geometries, enabling 90-degree bends with 2.5mm inside radius.
Final Summary:
The optimized enclosure design consolidated 11 stamping operations into 4 integrated progressive die stages, achieved 89% material utilization efficiency through advanced nesting optimization, and integrated EMI shielding gasket retention features eliminating 3 secondary assembly operations. Stamping cycle time reduced from 47 to 21 minutes.
Execution
Process Description:
Implementation required extensive electromagnetic compatibility validation through accredited FCC testing laboratories, including conducted emissions testing per Part 15.107 and radiated emissions testing per Part 15.109 requirements across entire 5G frequency spectrum. The project team established integrated manufacturing cells combining progressive stamping, automated deburring, and final inspection operations.
Outcome
Value Comparison:
The DFM optimization delivered exceptional improvements in manufacturing efficiency and product performance, generating $2.9M annual savings through reduced processing costs and eliminated secondary operations. Direct labor cost reduction of $14.50 per enclosure through cycle time optimization contributed $1.81M annually based on 125,000-unit production volume.
Client Testimonial:
"This comprehensive DFM optimization transformed our telecommunications enclosure manufacturing from a complex, multi-stage operation into a streamlined, highly efficient process that meets the demanding quality and cost requirements of 5G network deployment. The 44% reduction in stamping operations combined with integrated EMI shielding features fundamentally improved our manufacturing competitiveness."
- Lisa Wong, Senior Manufacturing Engineering Director, Cisco Systems San Jose Manufacturing Operations